3DR-V6-460SX – Xilinx Virtex 6 Power PC

The 3DR-V6-460SX central processing module consists of a Power PC (PPC-460SX) general purpose processor, a Xilinx (Virtex 6) FPGA, on board DDR2 memory modules, and a combination of PCIe, LVDS, and SerDes commercially available I/O modules. Its applications include general purpose/digital signal processing, radar receiver/exciter, digital array processing and beamforming, electronic warfare/attack systems, SIGINT (ELINT, COMINT, etc.) systems, digital image processing and remote sensing.



At the heart of the 3DR Computing family architecture is the 3DR-V6-460SX Central Processing Module. This module consists of a Power PC (PPC-460SX) general purpose processor, a Xilinx (Virtex 6) FPGA, on board DDR2 memory modules, and a combination of PCIe, LVDS, and SERDES commercially available I/O modules. The processing modules also provide dual Gigabit Ethernet ports, JTAG, and RS-232. The variety of available standard interfaces promotes network connectivity with a wide range of 3rd party systems and subsystem. This includes commercially available switches and routers and promotes the integration of a system-of-systems in a net-centric environment.

The 3DR Computing standard micro-controller architecture is interfaced through the I2C bus to provide FPGA and PPC temperature, voltage, and current monitoring for automatic shut-down during critical over heat and/or voltage conditions.

As with all 3DR Computing modules, the 3DR-V6-460SX supports 3 dimensional connectivity, allowing the user to stack and/or tile modules to address a wide variety of processing, I/O, size, weight, and power requirements.


  • General Purpose/Digital Signal Processing
  • Radar Receiver/Exciter
  • Digital Array Processing and Beamforming
  • Electronic Warfare/Attack Systems
  • SIGINT (ELINT, COMINT, Etc.) Systems
  • Digital Image Processing
  • Remote Sensing


Product Benefits

  • Employs onboard current limiting circuitry and fused temperature monitoring chip
  • Additional I/O support available via dual Gigabit Ethernet ports, JTAG, and standard RS-232 connections
  • Dual Gigabit Ethernet ports support TCP/IP
  • Power supplied via standard 4-pin power connector

Power PC

  • PPC-460SX (800MHz to 1.2 GHz)
  • Up to 4GB DDR2 memory at 800MHz
  • 64MB Boot Flash
  • 512 MB NAND Flash


  • Xilinx Virtex 6 (XC6VLX240T)
  • DDR2 memory
  • Up to 533MHz supporting sizes
  • Up to 4GB at various speeds

3D Connectivity Via:

  • PCIe
  • LVDS
  • SerDes
  • 39 GB/sec of bandwidth per module


Standard 3DR-V6-460SX Microcontroller Interface

  • Dual Microcontrollers Programmable over SPI bus
  • Controls Power-on and Power-down Sequencing
  • Monitors Voltages and Reports faults over I2C bus
  • Monitors Current, e-fuse shut-down, and reports over I2C bus
  • Monitors board temperature over I2C bus (external sensor available)
  • On board EEPROM for data storage and logging (write protect available)
  • Two RS-232 debug ports
  • FPGAs and CPLDs programmable over JTAG Bus (for applicable modules with FPGAs and CPLDs)


  • Power Consumption: 12V @ 3.8 Amps (Subject to FPGA loading)
  • Supply Options: 12V Power Cable
  • Additional Power Features: e-fuse/continuous power monitoring


  • AMCC PPC460SX (1.0 GHz)
  • DDR2 —> 2GB (up to 4GB) at 800 MHz
  • PPC Boot Flash —> 64MB
  • NAND Flash —> 512MB
  • PPC Local Bus —> up to 100 MHz at 32 bits


  • Xilinx, Virtex 6 XC6VLX240T
  • LX365T & LX550T available in 1759 package
  • 2 Nor Flash Configuration/User Programmable Memories
  • JTAG Programmable
  • Master BPI Configuration
  • Write Protects Available


  • Operating Temperature: 0°C – 50°C
  • Storage Termperature: (est) -40°C to 85°C
  • Cooling: Airflow recommended; FPGA dependent
  • Relative Humidity: 10-90% non condensing
  • Shock/Vibration: Please contact CEI for Configuration


  • Board dimensions: 6.25″L x 6.25″W
  • Dimensions including connectors: 6.668″L x 6.668″W
  • Distance between boards (Stacked, Board-to-Board): 1.1″
  • Weight: 11 oz

External Interfaces

  • Two 1G Ethernet ports
  • Ethernet Hardware Acceleration —> TCP/IP built into PPC with support for Jumbo Frames
  • Ethernet Performance —> 840 Mb/s (with HW acceleration)
  • Gen1 or Gen2 PCIe
  • X1, X2 Connectors —> PCIe (FPGA/PPC); LVDS (FPGA)
  • Y1, Y2 Connectors —> PCIe (PPC); LVDS (FPGA)
  • Z1, Z1 Connectors —> PCIe (FPGA/PPC); LVDS (FPGA)
  • Z3, Z4 Connectors —> SERDES (FPGA)
  • USB 2.0
  • RS-232