[vc_row][vc_column][vc_column_text css=”.vc_custom_1506107482536{margin-top: -40px !important;}”]

SYSTEMS & SUBSYSTEMS DESIGN SERVICES

[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column][vc_separator color=”custom” border_width=”6″ el_width=”60″ accent_color=”#8a29b6″ css=”.vc_custom_1502912552018{margin-top: -30px !important;}”][vc_single_image image=”6356″ img_size=”1000×450″ alignment=”center”][vc_column_text]Starting a new project from scratch can be an extremely costly and time consuming proposition. From defining requirements, performing feasibility studies, part selection, layout, design  fabrication and debug, many variable can cut into your product’s design cycle and budget. CEI has decades worth of experience designing and manufacturing turnkey solutions for commercial, industrial automotive and military markets. We’d like to share our experience with you.[/vc_column_text][/vc_column][/vc_row][vc_row css=”.vc_custom_1506108091731{margin-top: 20px !important;}”][vc_column width=”1/4″][vc_single_image image=”6122″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506636074418{margin-right: 100px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506476768777{margin-right: 20px !important;margin-left: -120px !important;}”]

TURNKEY SOLUTIONS

You have an idea but may not know how to build it. CEI’s broad expertise in hardware, firmware, software and mechanical design gives us the ability to turn your ideas into fruition. No matter what part of the design cycle you are in, we can help get you to where you want to be – quickly and efficiently.[/vc_column_text][/vc_column][vc_column width=”1/4″][vc_single_image image=”6123″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506476650469{margin-right: 100px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506476542302{margin-right: 20px !important;margin-left: -120px !important;}”]

MANUFACTURING AND INTEGRATION

CEI not only designs your product, but can help manufacture it as well.  Whether you need low-volume builds or high-throughput manufacturing, we can help.  Our cross-trained staff achieves the precision of low-volume production. For higher-volumes, our proven contract manufacturing (CM) partners help get your job done.[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_single_image image=”6124″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506477215662{margin-right: 100px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506477148772{margin-right: 20px !important;margin-left: -120px !important;}”]

MODELING AND SIMULATION

We use the latest, most advanced modeling and simulation tools to ensure that your design works just the way you intended.  Our skilled engineers are trained to balance knowledge and tool utilization to help advance the total project.  We don’t rely on just one brain or one tool when we design your product — we take advantage of the best of both.[/vc_column_text][/vc_column][vc_column width=”1/4″][vc_single_image image=”5139″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506477112857{margin-right: 100px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506476993771{margin-right: 20px !important;margin-left: -120px !important;}”]

REMOTE SENSING & SENSOR FUSION

CEI can design standalone boards or create systems which allow for fusion of numerous sensor devices and data.  The ability to fuse sensor functionality positively impacts our ability to minimize our designs and to meet stringent size requirements.[/vc_column_text][/vc_column][/vc_row][vc_row css=”.vc_custom_1506477267732{margin-top: -70px !important;}”][vc_column width=”1/4″][vc_video link=”https://www.youtube.com/watch?v=7exTEMacjy8&feature=youtu.be” title=”CNN Security Video”][/vc_column][vc_column width=”1/4″][vc_video link=”https://www.youtube.com/watch?v=k_sKHUZWNyo&feature=youtu.be” title=”94 GHz Landing”][/vc_column][/vc_row][vc_row css=”.vc_custom_1506109646998{margin-top: 40px !important;}”][vc_column width=”1/4″][vc_single_image image=”6126″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506477443561{margin-right: 100px !important;padding-left: -30px !important;}”][vc_empty_space][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506477362508{margin-right: 20px !important;margin-left: -120px !important;}”]

SUBSYSTEMS

CEI is both a lead design house and a design house that designs sub-system componentry.  The same engineering expertise goes into our design work whether we are the “Prime” or the “Sub” in the development process.  We strive to deliver the systems (sub-systems) that our clients need as a component of a larger, more complex solution.[/vc_column_text][vc_empty_space][/vc_column][vc_column width=”1/4″][vc_single_image image=”5141″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506477490445{margin-right: 100px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506477519878{margin-right: 20px !important;margin-left: -120px !important;}”]

HIGH PERFORMANCE COMPUTING 

CEI has an established high-performance computing and 3D computing product line with Arria 10 SoC and Stratix 10 SoC HPC-specific products in development. CEI is committed to developing cutting-edge solutions utilizing both FPGAs and GPUs. A significant advantage to this effort is our partner relationships.[/vc_column_text][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_single_image image=”6127″ img_size=”130X130″ alignment=”center” css=”.vc_custom_1506478053496{margin-right: 100px !important;margin-bottom: -30px !important;padding-left: -30px !important;}”][/vc_column][vc_column width=”1/4″][vc_column_text css=”.vc_custom_1506477957831{margin-right: 20px !important;margin-left: -120px !important;}”]

SYSTEMS PARTNERSHIPS

[/vc_column_text][/vc_column][vc_column width=”1/4″][/vc_column][vc_column width=”1/4″][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_single_image image=”5951″ img_size=”full” onclick=”custom_link” img_link_target=”_blank” link=”https://www.intel.com/content/www/us/en/homepage.html” css=”.vc_custom_1506029013832{margin-top: 40px !important;}”][/vc_column][vc_column width=”1/4″][vc_single_image image=”5952″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”https://www.infineon.com”][/vc_column][vc_column width=”1/4″][vc_single_image image=”4257″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”http://www.analog.com/en/index.html”][/vc_column][vc_column width=”1/4″][vc_single_image image=”5472″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” css=”.vc_custom_1506028135742{margin-top: 30px !important;}” link=”https://www.nxp.com”][/vc_column][/vc_row][vc_row][vc_column width=”1/4″][vc_single_image image=”5966″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”https://www.nvidia.com/page/home.html” css=”.vc_custom_1506028171982{margin-top: 15px !important;}”][/vc_column][vc_column width=”1/4″][vc_single_image image=”5972″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”https://www.amd.com/en-us/markets/partners”][/vc_column][vc_column width=”1/4″][vc_single_image image=”5470″ img_size=”medium” onclick=”custom_link” img_link_target=”_blank” link=”https://www.ti.com” css=”.vc_custom_1506028551537{margin-top: 25px !important;}”][/vc_column][vc_column width=”1/4″][vc_single_image image=”3534″ img_size=”medium” onclick=”custom_link” link=”https://www.arrow.com/en/arrow-services/third-party-design-through-aces”][/vc_column][/vc_row][vc_row][vc_column][vc_video link=”” el_width=”50″ title=”CNN Security”][/vc_column][/vc_row]